Rockwood offers individually tailored solutions for each customer's requirements in wafer surface processing, cleaning and handling substrates. These services include:-
- Wafer Grinding
- Wafer Thinning + Double side Polishing.
- Wafer Dicing, Wafer Re-Sizing, Edge Processing & Edge Trimming.
- Wafer Bonding
- Sapphire wafer surface preparation for EPI.
- Sapphire wafer reclaim.
- Silicon wafer reclaim.
- Wafer supply, New or Reclaimed.
We have been providing wafer processing services offering a local, high quality, reliable, value for money service to our customers for over thirty years. As well as providing unrivalled technical support.
We are dynamic and flexible to our customer's requirements and take the time to really understand your needs to provide exactly what is specified.
Rockwood is located in the south of France in the Rousset region where ~40% of French Semiconductor manufacturing takes place.